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PlantU INK Pro
PlantU INK Pro

PlantU INK Pro automatically identifies and marks failed and at-risk dies. PAT and geometric algorithms support intelligent marking, INK Map calculation and automated output for risk-die selection, die marking and quality management.

Product Functions
Support defect-based die selection, Shot INK for specified BIN codes, Repeat Shot INK across masks, and statistical Zone INK filtering.
Expand risk zones around target dies or BIN categories using circles, ellipses, crosses, rectangles, or neighboring grids.
Define wafer risk areas by radius and angle, or use inverse selection to mark affected regions directly in INK Pro.
Deployment Benefits
  • 1
    Use wafer test results and defect distributions to identify and mark at-risk dies. Compared with manual selection, efficiency improves by 120 times and the risk of manual-operation errors is eliminated.
  • 2
    Use big data to track high-risk chips, flag anomalies, and address testing or process issues before they spread, improving yield and quality stability.
  • 3
    Align different coordinate systems across product information, exposure positions, wafer test data and defect data for accurate overlays and reliable marking of at-risk dies.
  • 4
    Clear tracking results: review automated tracking after key process inspections, overlay layer markings and analyze rule-based tracking statistics to improve processes.
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